Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers /

Bibliographic Details
Main Author:	Franke, Jörg, Dipl.-Ing (Author)
Corporate Author:	Knovel (Firm)
Format:	eBook
Language:	English
Published:	Munich ; Cincinnati, OH : Hanser, [2014]
Subjects:	Interconnects (Integrated circuit technology) > Design and construction. Injection molding of plastics. Electronic books.
Online Access:	Connect to the full text of this electronic book