Multichip module technology handbook /

Bibliographic Details
Main Author:	Garrou, Philip E.
Other Authors:	Turlik, Iwona
Format:	Book
Language:	English
Published:	New York : McGraw-Hill, [1998]
Series:	Electronic packaging and interconnection series.
Subjects:	Multichip modules (Microelectronics) Microelectronic packaging. Integrated circuits > Very large scale integration > Design and construction.