Cost modeling system for the IC packaging industry /
The semiconductor market is experiencing a remarkable growth, causing similar growth patterns for the IC packaging world. Semiconductor companies are building new fabs in an effort to keep up with the demand for their die. With costs for new fabs running $1 billion and up, packaging subcontractors...
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Format: | Thesis Book |
Language: | English |
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[Place of publication not identified] :
[publisher not identified] ;
1998.
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Online Access: | http://proxy.library.tamu.edu/login?url=http://proquest.umi.com/pqdweb?did=737704071&sid=1&Fmt=2&clientId=2945&RQT=309&VName=PQD |
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http://proxy.library.tamu.edu/login?url=http://proquest.umi.com/pqdweb?did=737704071&sid=1&Fmt=2&clientId=2945&RQT=309&VName=PQDAvailable Online
Call Number: |
1998 Dissertation C375 |
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Call Number | Status | Get It |
1998 Dissertation C375 | Available |
Cushing: Theses & Dissertations Microforms (Does not check out)
Call Number: |
1998 Dissertation C375 |
|
---|---|---|
Call Number | Status | Get It |
1998 Dissertation C375 | Available |