Influence of cooling hole geometry and material conductivity on the thermal response of cooled silicon nitride plate /

Bibliographic Details

Main Author:	Abdul-Aziz, Ali
Corporate Author:	NASA Glenn Research Center
Other Authors:	Bhatt, Ramakrishna T., Girgis, Morris
Format:	Government Document Microform Book
Language:	English
Published:	Cleveland, Ohio : Hanover MD : National Aeronautics and Space Administration, Glenn Research Center ; Available from NASA Center for AeroSpace Information, [2002]
Series:	NASA technical memorandum ; 211688.
Subjects:	Ceramics. Silicon nitride. Finite elements. Cooling plates. Silicon nitrides. Stress analysis. Cooling channels.
Online Access:	https://purl.fdlp.gov/GPO/LPS43726