Lead-free solder interconnect reliability /

Bibliographic Details
Corporate Author:	Knovel (Firm)
Other Authors:	Shangguan, Dongkai, 1963-
Format:	eBook
Language:	English
Published:	Materials Park, OH : ASM International, 2005.
Subjects:	Microelectronic packaging > Reliability. Solder and soldering. Lead-free electronics manufacturing processes. TECHNOLOGY & ENGINEERING > Electronics > Digital. TECHNOLOGY & ENGINEERING > Electronics > Microelectronics. Electronic books.
Online Access:	Connect to the full text of this electronic book