Robust design of microelectronics assemblies against mechanical shock, temperature and moisture /

This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. De...

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Bibliographic Details

Main Authors:	Wong, E-H (Author), Mai, Y. W., 1946- (Author)
Corporate Author:	Knovel (Firm)
Format:	eBook
Language:	English
Published:	Cambridge, UK : Woodhead Publishing, [2015]
Series:	Woodhead Publishing series in electronic and optical materials ; no. 81.
Subjects:	Computer engineering. Microelectronics > Design. TECHNOLOGY & ENGINEERING / Mechanical. TECHNOLOGY & ENGINEERING / Electronics / Microelectronics. Electronic books.
Online Access:	Connect to the full text of this electronic book