Advances in Condition Monitoring and Structural Health Monitoring : WCCM 2019 /

This book comprises the selected contributions from the 2nd World Congress on Condition Monitoring (WCCM 2019), held in Singapore in December 2019. The contents focus on digitalisation for condition monitoring with the emergence of the fourth industrial revolution (Industry 4.0) and the Industrial I...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Gelman, Len (Editor), Martin, Nadine (Editor), Malcolm, Andrew A. (Editor), (Edmund) Liew, Chin Kian (Editor)
Format: eBook
Language:English
Published: Singapore : Springer Singapore : Imprint: Springer, 2021.
Edition:1st ed. 2021.
Series:Lecture Notes in Mechanical Engineering,
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Call Number: TA352-356
 
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